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W66CQ2NQUAHJ
Classify
Memory - Batteries - Configuration Proms for FPGAs - Controllers - Memory
Manufacturer
Winbond Electronics
Description
IC DRAM 4GBIT LVSTL 11 200WFBGA
Detailed Description
SDRAM - Mobile LPDDR4X Memory IC 4Gbit LVSTL_11 2.133 GHz 3.5 ns 200-WFBGA (10x14.5)
Delivery Cycle
28 week(s)
Product Attributes
Operating Temperature
-40°C ~ 105°C (TC)
Memory Interface
LVSTL_11
Memory Organization
128M x 32
Packaging
Tray
Memory Type
Volatile
Technology
SDRAM - Mobile LPDDR4X
Write Cycle Time - Word, Page
18ns
Package / Case
200-WFBGA
Supplier Device Package
200-WFBGA (10x14.5)
Clock Frequency
2.133 GHz
Memory Format
DRAM
Access Time
3.5 ns
Voltage - Supply
1.06V ~ 1.17V, 1.7V ~ 1.95V
Memory Size
4Gbit
Mounting Type
Surface Mount
DigiKey Programmable
Not Verified
Documents & Media
Datasheets:W66BQ6NB, W66CQ2NQ
Other Related Documents:Declaration on California Proposition 65
Environmental Information:Winbond Electronics RoHS Cert